The ProPlus advanced modeling solutions include the BSIMProPlus Device Modeling and Verification Platform, as well as the NoisePro/9812B Low-frequency Noise Characterization and Modeling System, which have served as the de-facto industry standard for leading semiconductor companies in the world including foundries, IDMs and fabless companies for more than two decades.

BSIMProPlus is the most efficient and accurate SPICE model extraction platform on the market for digital, analog/mixed-signal, and RF modeling applications. It supports all public domain SPICE models and popular proprietary models for various process technologies such as CMOS, BiCMOS, Bipolar and HBT including bulk CMOS, SOI, FinFET, TFT and HVMOS/LDMOS, etc. BSIMProPlus can be used for Spice model development, automated data acquisition, SPICE parameter extraction and optimization, model validation and documentation of DC,CV, RF, noise and reliability models.

BSIMProPlus provides the industry's only mature commercial modeling solution for HCI/NBTI/PBTI reliability effects, which has been used by leading semiconductor companies for modeling sub-100nm MOSFETs for many years. The ProPlus Layout Proximity Effect (LPE) modeling solution, as the first commercially available solution validated by real process technologies, is targeted to model the layout dependence of device characteristics induced by strain-engineering process techniques in sub-45nm technology nodes.

To meet the challenges of increasing model computation complexities, BSIMProPlus tightly integrates a parallel SPICE engine with fast statistical analysis capabilities and built-in Verilog-A support. This enables users to handle any sophisticated SPICE models accurately and efficiently, and provides native support for statistical modeling as a key component in ProPlus DFY modeling solutions.


NoisePro/9812B is the industry's golden solution for low-frequency noise characterization and modeling applications since the mid-90s, and has been adopted by over 100 leading semiconductor companies and research institutes. The system has been widely proven and used to accurately measure the low-frequency noise characteristics for packaged or wafer-level semiconductor devices, including MOSFET, BJT, diode, and resistor, etc. and is also capable of measuring and analyzing Random Telegraph Signal (RTS) noise. The wafer-level automatic flicker noise characterization system makes it possible to monitor the gate oxide in a mass-production process environment.