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ProPlus 2010 Technology Seminar Featuring Advanced SPICE Modeling, Simulation and Verification Solutions
Beijing, China, Nov 18, 2010 - ProPlus hold the "2010 ProPlus Technology Seminar" at the Shanghai Pudong Holiday-Inn Hotel.
Attracted over 100 attendees from semiconductor manufacturing, IDMs, IC design house and research institutes,
the one-day seminar discussed the challenges at advanced technology nodes, and featured next generation technologies of
advanced Spice modeling, circuit simulation and verification solutions from ProPlus.
Photo of the seminar venue
Echoing the theme "Performance-competitive IC Design: Model Building and Verification Challenges in Nanometer Era".
Dr. James Ma kicked off the seminar by a keynote speech "Challenge and Opportunity in Circuit Simulation and Verification".
"We see increasing challenges for IC designs at advanced technology nodes, in the whole design chain, from EDA tool development,
tool/flow integration, Spice modeling, circuit design to manufacturing. The efficiency and accuracy of circuit simulations/verifications
significantly impact the final product competitiveness.", Dr. Ma said in his speech, "To meet the needs, ProPlus will provide
innovative solutions with tightly integrated design flow covering Spice modeling, circuit simulation and verification, aiming
to shorten time-to-market, better utilize process capability and explore the potential, trade-off design performance and yield,
and increase product competiveness eventually".
Dr. James Ma, Professor Zhiping Yu, and Dr Lianfeng Yang. (From left to right)
In the event, ProPlus announced its revolutionary new version Spice modeling platform,
that for the first time in the industry takes full advantages of hardware acceleration technologies and tightly
integrates a full Spice engine. With such breakthrough, on top of its 17 years leading position,
BSIMPro+ series products have once again brought Spice modeling to a new level.
The experts from ProPlus also shared their insights on other various topics including:
the modeling challenges for nanometer era, recent advancements on ProPlus technologies, advanced BJT modeling, etc.
A product demo illustrating new hardware acceleration techniques was arranged to show significant performance
improvements for both Spice model extractions and circuit simulations.
In addition, ProPlus also invited two well-known experts, IEEE Fellow, Professor Zhiping Yu from Tsinghua University
and Dr. Waisum Wong, the Director of Technology Development at SMIC, to share their insights on advanced modeling in
the nanometer era. The seminar provided a forum for experts and audience to share their ideas and thoughts from
different angles including EDA, IC design, manufacturing, research, etc, discuss emerging challenges in foreseeable future,
and explore potential solutions from ProPlus.
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