ProPlus to Showcase Its DFY-oriented Advanced Modeling, Simulation and Verification Technologies

San Jose, CA, May 2, 2011 ProPlus Design Solutions, Inc., today announced it will showcase its innovative DFY-enabling technologies at the 48th Design Automation Conference (DAC) to be held on June 5-10 in San Diego Convention Center, CA, USA. The technologies developed for design-for-yield applications, including advanced Spice model development and validations, DFY-enabled circuit simulations and electrical verifications, will be presented in ProPlus Booth 2025. Experts on circuit designs, Spice modeling and CAD, and other interested prospective users are invited to register for ProPlus demos at DAC by sending emails to dac@proplussolution.com.

The Design Automation Conference (DAC) is the premier event for the design of electronic circuits and systems, and for EDA and silicon solutions. As the world's leading technical conference and trade show on electronic design automation, DAC is where the IC Design and EDA ecosystem learns, networks, and does business. . DAC is also where the latest technical research is presented. DAC covers all topics related to the design complex systems on chip: Embedded System design & verification down to physical layout verification & test. Now in its 48th consecutive year, DAC is the most respected name in the chip design community.


About ProPlus:

ProPlus Design Solutions, Inc. develops cutting-edge technologies to enhance the linkage between design and manufacturing, and delivers innovative EDA solutions for DFY. It is based on their Device Modeling Platform BSIMProPlus™ that has been the choice for leading semiconductor companies since mid-90s, and the Circuit Design and Electrical Verification Platforms NanoDesigner™ and NanoVerifier™ targeted to meet the challenges of performance and yield trade-offs for advanced circuit designs. ProPlus has R&D centers in both US and China, branch offices in Tokyo, Hsinchu and Shanghai.