NEWS ( June / 01 / 2011 )

ProPlus Design Solutions and GRID Simulation Technology Announce Strategic Partnership

New solution provides full-chip electro-migration, IR drop (EMIR) simulation in Low-Power Designs with SPICE accuracy

San Jose, CA; Tokyo, Japan; Shanghai, China; June 1, 2011 ProPlus Design Solutions, Inc. (ProPlus), the device modeling technology leader, and GRID Simulation Technology, Inc. (GRID), the leader in SPICE-accurate EMIR verification and sign-off solutions for low-power electronic designs, announced a strategic partnership to deliver the most accurate and fastest EMIR signoff solution for very large-low power designs. The integration of ProPlus modeling technology with GRID's hierarchical power network analysis delivers for the first time, a full-chip, device level simulation of EMIR effects in low-power designs.

"As technology scales down, low power designs require more accurate and scalable verification solutions. While many of the solutions today have to trade off the accuracy for performance, the joint efforts of ProPlus and GRID have made a breakthrough in EMIR simulation," said Dr. Zhihong Liu, Executive Chairman of ProPlus. "We are happy to work with GRID in delivering this much needed industry solution."

"We provide designers a scalable SPICE-accurate qualification and verification solution for EMIR simulation," said Wai Yan Ho, CEO of GRID. "For the first time in the industry, customers receive a detailed hierarchical report providing 100% visibility and traceability of nodal values, branch currents, independent loops, and total power consumption for device, IP block, and complex SoCs with GRID and Proplus tools and methodology. I look forward to our future cooperation with ProPlus."

Low power design and verification teams face growing sign-off challenges at advanced process nodes. Power network analysis tools, which are critical to tape-out and successful silicon, typically utilize reduction techniques to speed up runtime performance at the expense of accuracy and tool-to-tool traceability. GRID's hierarchical analysis eliminates the need for reduction methods and delivers complete visibility of the power behavior of all nodes in a design.


About GRID:
GRID is an Electronic Design Automation (EDA) company delivering the world's largest and most complex low-power electronic design, verification and sign-off solutions at true SPICE-accuracy through its revolutionary new verification and sign-off technology. The company's core technology NanoRAIL, and HPDA (hierarchical, parallel, distributed, architecture) platform provides multiple products for SPICE-accurate analysis of IC power grid problems including IR voltage drop and electro-migration (EM), and the qualification of complex power network analysis results. GRID's products include: NanoRAIL-HGP, NanoRAIL-SoC, NanoRAIL-TR, NanoSource, SimCHECK, and GRIDViewer. GRID is a privately held California Corporation headquartered in Morgan Hill, CA with offices in: East Fishkill, NY; and Tokyo, Japan.

NanoRAIL-HGP, NanoRAIL-SoC, NanoRAIL-TR, NanoSource, SimCHECK, and GRIDViewer are trademarks of GRID Simulation Technology, Inc.

For more information about GRID see: www.gridsimtech.com


About ProPlus:
ProPlus develops cutting-edge technologies enhancing the linkage between design and manufacturing to deliver innovative EDA solutions for DFY. The technology is based on BSIMProPlus, a leading Device Modeling Platform choice for semiconductor companies since the mid-90s, and NanoDesigner and NanoVerifier, Circuit Design and Electrical Verification Platforms targeted to meet the advanced circuit design challenges of performance and yield. ProPlus is a California Corporation headquartered in San Jose, CA with R&D centers in both US and China, and branch offices in Tokyo, Hsinchu and Shanghai.

BSIMProPlus, NanoDesigner and NanoVerifier are trademarks of ProPlus Design Solutions, Inc.

For more information about ProPlus : www.proplussolution.com

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